Ukwenziwa kwePCB
Ukuveliswa kwe-PCB kubhekiselele kwinkqubo yokudibanisa i-conductive traces, i-insulating substrates, kunye namanye amacandelo kwibhodi yesekethe eprintiweyo kunye nemisebenzi yesekethe ethile ngoluhlu lwamanyathelo anzima.Le nkqubo ibandakanya izigaba ezininzi ezifana noyilo, ukulungiswa kwezinto, ukubhola, ukubethelwa kobhedu, i-soldering, kunye nokunye, okujoliswe ekuqinisekiseni ukuzinza kunye nokuthembeka kokusebenza kwebhodi yesekethe ukuhlangabezana neemfuno zezixhobo zombane.Ukwenziwa kwePCB yinxalenye ebalulekileyo yoshishino lokwenziwa kwe-elektroniki kwaye isetyenziswa kakhulu kwiinkalo ezahlukeneyo ezinjengonxibelelwano, iikhompyutha, kunye nee-elektroniki zabathengi.
Uhlobo lweMveliso
Ibhodi yesekethe eprintiweyo ye-TACONIC
Ibhodi yePCB yonxibelelwano lwamaza okukhanya
Rogers RT5870 ibhodi high-frequency
I-TG ephezulu kunye ne-high-frequency Rogers 5880 PCB
Ibhodi yePCB yokulawula umaleko amaninzi
I-4-layer FR4 PCB
Izixhobo zokwenziwa kwePCB
Ikhono lokuvelisa iPCB
Izixhobo zokwenziwa kwePCB
Ikhono lokuvelisa iPCB
| into | Umthamo wokuvelisa |
| Inani leeleya zePCB | 1 ~ 64th umgangatho |
| Inqanaba lomgangatho | Uhlobo lwekhompyutha yeshishini 2|IPC uhlobo 3 |
| I-Laminate / Substrate | FR-4|S1141|High Tg|PTFE|CeramIC PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon Ha logen free etc. |
| Iimpawu zeLaminate | Kingboard|I TEQ|shegnyi|Nanya|lsola |TUC |S YL|Arlon|Nel co |Taconic |H i ta chi|Rogers et al. |
| izixhobo zobushushu obuphezulu | Tg eqhelekileyo: S1141|KB6160|I-Huazhen H14 0 (ayisebenzi kwinkqubo engenalo isikhokelo) |
| Phakathi Tg: HDI, multi-layer: SY S1000H |ITEQI T158 |HuazhengH150|TU-662 |SY S1150G|HuazhengH150HF|H160HF; | |
| I-Tg Ephakamileyo: Ubhedu olungqindilili, ukuphakama okuphezulu ：SY S1000-2|I TEQIT180A|HuazhengH170|ISOLA : FR408R |370HR|TU-752|SY S1165 | |
| Ibhodi yesekethe ephezulu | Rogers |Arlon|Taconic|SY SCGA-500|S7136|Huazheng H500C |
| Inani leeleya zePCB | 1 ~ 64th umgangatho |
| Inqanaba lomgangatho | Uhlobo lwekhompyutha yeshishini 2|IPC uhlobo 3 |
| I-Laminate / Substrate | FR-4|S1141|High Tg|PTFE|CeramIC PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon Ha logen free etc. |
| Iimpawu zeLaminate | Kingboard|I TEQ|Sheng Yi|Nanya|lsola |TUC |S YL|Arlon|Nel co |Taconic |H i ta chi|Rogers et al. |
| izixhobo zobushushu obuphezulu | Tg eqhelekileyo: S1141|KB6160|I-Huazhen H14 0 (ayisebenzi kwinkqubo engenalo isikhokelo) |
| Phakathi Tg: HDI, multi-layer: SY S1000H |ITEQI T158 |HuazhengH150|TU-662 |SY S1150G|HuazhengH150HF|H160HF; | |
| I-Tg Ephakamileyo: Ubhedu olungqindilili, ukuphakama okuphezulu ：SY S1000-2|I TEQIT180A|HuazhengH170|ISOLA : FR408R |370HR|TU-752|SY S1165 | |
| Ibhodi yesekethe ephezulu | Rogers |Arlon|Taconic|SY SCGA-500|S7136|Huazheng H500C |
| Inani leeleya zePCB | 1 ~ 64th umgangatho |
| Inqanaba lomgangatho | Uhlobo lwekhompyutha yeshishini 2|IPC uhlobo 3 |
| I-Laminate / Substrate | FR-4|S1141|High Tg|PTFE|CeramIC PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon Ha logen free etc. |
| Iimpawu zeLaminate | Kingboard|I TEQ|Sheng Yi|Nanya|lsola |TUC |S YL|Arlon|Nel co |Taconic |H i ta chi|Rogers et al. |
| izixhobo zobushushu obuphezulu | Tg eqhelekileyo: S1141|KB6160|I-Huazhen H14 0 (ayisebenzi kwinkqubo engenalo isikhokelo) |
| Phakathi Tg: HDI, multi-layer: SY S1000H |ITEQI T158 |HuazhengH150|TU-662 |SY S1150G|HuazhengH150HF|H160HF; | |
| I-Tg Ephakamileyo: Ubhedu olungqindilili, ukuphakama okuphezulu ：SY S1000-2|I TEQIT180A|HuazhengH170|ISOLA : FR408R |370HR|TU-752|SY S1165 | |
| Ibhodi yesekethe ephezulu | Rogers |Arlon|Taconic|SY SCGA-500|S7136|Huazheng H500C |
| Ubukhulu bepleyiti | 0.1~8.0mm |
| Ukunyamezela ipleyiti ubukhulu | ±0.1mm/±10 % |
| Ubuncinci besiseko sobunzima bobhedu | Umaleko wangaphandle : 1/3oz(12um)~ 1 0oz |umaleko wangaphakathi: 1/2oz~6oz |
| Ubuninzi obugqityiweyo bobhedu obugqityiweyo | 6 iiounces |
| Ubuncinci besayizi yokomba yoomatshini | 6mil(0.15mm) |
| Ubuncinci besayizi yokomba yelaser | 3 yezigidi (0 . 075mm) |
| Ubuncinci besayizi yokomba ye-CNC | 0.15mm |
| Uburhabaxa bodonga lomngxuma (ubuninzi) | 1.5 yezigidi |
| Ubuncinane bobubanzi bomkhondo/isithuba (umaleko ongaphakathi) | I-2/2mil (I-ayer yangaphandle :1 /3oz, i-inner l ayer: 1/2oz) (H/H OZ isiseko sobhedu) |
| Ubuncinane bobubanzi bomkhondo/isithuba (umaleko wangaphandle) | 2.5/2.5mi l (H/H OZ isiseko sobhedu) |
| Ubuncinane bomgama phakathi komngxuma kunye nomqhubi wangaphakathi | 6000000 |
| Ubuncinci umgama ukusuka emngxunyeni ukuya kwi-conductor yangaphandle | 6000000 |
| Ngeringi encinci | 3000000 |
| Umngxuma wecandelo ubuncinci besangqa somngxuma | 5000000 |
| Ubuncinci BGA ubukhulu | 800w |
| Ubuncinci bezithuba ze-BGA | 0.4mm |
| Ubuncinci berula yomngxuma egqityiweyo | 0.15m m(CNC) |0. 1mm(laser) |
| isiqingatha somngxuma ububanzi | Isiqingatha somngxuma omncinci ubukhulu besiqingatha: 1mm, isiqingatha seKong sisixhobo esikhethekileyo, ke ngoko, isiqingatha somngxuma kufuneka sibe sikhulu kune-1mm. |
| Umngxuma udonga lobhedu (thinnest) | ≥0.71 yezigidi |
| Umngxuma udonga lobhedu (umndilili) | ≥0.8 yezigidi |
| Ubuncinci besithuba somoya | 0.07 mm (3 yezigidi) |
| Iasphalt yomatshini wokubekwa entle | 0. 07 mm (3 million) |
| ubungakanani bomgangatho ophezulu | 20:01 |
| Ubuncinci bebhulorho yemaski yobubanzi | 3000000 |
| IMaski yeSolder / Iindlela zonyango lweSekethe | ifilimu |LDI |
| Ubuncinci bobunzima bomaleko wokugquma | 2 yezigidi |
| HDI & uhlobo olulodwa PCB | HDI (1-3 amanyathelo) |R-FPC(2-16 umaleko)丨Uxinzelelo oluphezulu oluxubeneyo olwenziwa ngamaxesha amaninzi(2- 14th floor)丨UbuCapacita bokuNgcwaba kunye noKuxhathisa... |
| ubuninzi.PTH (umngxuma ongqukuva) | 8 mm |
| ubuninzi.I-PTH (umngxuma ojikelezileyo) | 6*10mm |
| PTH ukutenxa | ±3mil |
| PTH ukutenxa (ububanzi | ±4mil |
| Ukutenxa kwe-PTH (ubude) | ±5mil |
| NPTH ukutenxa | ±2mil |
| NPTH ukutenxa (ububanzi) | ±3mil |
| NPTH ukutenxa (ubude) | ±4mil |
| Ukutenxa kwindawo yomngxuma | ±3mil |
| Uhlobo lomlinganiswa | inombolo yothotho |ibhakhowudi |Ikhowudi yeQR |
| Ubuncinci ububanzi boonobumba (legend) | ≥0.15mm, ububanzi bomlinganiswa obungaphantsi kwe-0.15mm abuyi kubonwa. |
| Ubuncinci ubude boonobumba (legend) | ≥0.8mm, ubude bomlinganiswa obungaphantsi kwe-0.8mm abuyi kubonwa. |
| Umlinganiselo womlinganiswa (legend) | I-1: 5 kunye ne-1: 5 zezona zilungelelaniso ezifanelekileyo kwimveliso. |
| Umgama phakathi komkhondo kunye necontour | ≥0.I-3mm (12mil), ibhodi enye ithunyelwe : Umgama phakathi komkhondo kunye ne-contour ≥0 .3mm, ithunyelwe njengebhodi yepaneli nge-V-cut : Umgama phakathi komkhondo kunye nomgca we-V-cut ≥0.4mm |
| Akukho ndawo yolawulo yesithuba | 0mm, Ithunyelwe njengephaneli , Isithuba sepleyiti yi-0mm |
| Iipaneli ezinezithuba | 1.6m m, qinisekisa ukuba umgama phakathi kweebhodi ngu ≥ 1.6mm, ngaphandle koko kuya kuba nzima ukucubungula kunye nocingo. |
| unyango olungaphezulu | TSO|HASL|HASL-free HASLLF(HASLLF)|Isilivere entywilisiweyo|Itoti entywilisiweyo|Iplating yegolide丨Igolide entywilisiweyo( EN IG)|ENEP IG|Goldfinger+HASL|ENIG+OSP |ENIG+Gold Finger|OSP+Gold Finger, njl. |
| Ukugqitywa kweMaski yeSolder | (1) .Ifilimu emanzi (Imaski ye-solder ye-L PI) |
| (2) .Isigqubuthelo sobuso sobuso | |
| Umbala wemaski yeSolder | eluhlaza |obomvu |Mhlophe |blue blue |mthubi |umbala orenji |Purple , ngwevu |Ukungafihli njl. |
| matte :green|blu |Mnyama njl. | |
| Umbala wesikrini sesilika | mnyama |Mhlophe |tyheli njl. |
| Uvavanyo lombane | Fixture/Flying Probe |
| Ezinye iimvavanyo | I-AOI, i-X-Ray (i-AU&NI), umlinganiselo omacala mabini, imitha yobhedu yomngxuma, uvavanyo lwe-impedance olulawulwayo (uvavanyo lweKhuphoni kunye neNgxelo yeQela leSithathu), i-metallographic microscope, umvavanyi wamandla amaxolo, uvavanyo lwezesondo oludityanisiweyo, uvavanyo lokungcoliseka kwengqondo. |
| Icontour | (1).Ucingo lweCNC (±0.1 mm) |
| (2).CN CV uhlobo lokusika (±0 .05mm) | |
| (3) .umkhohlisi | |
| 4) .Ukubetha ngundo (±0 .1 mm) | |
| amandla akhethekileyo | Ubhedu olungqingqwa, igolide eshinyeneyo (5U”), uMnwe wegolide, umngxuma oyimfama ongcwatywe, iCountersink, isiqingatha somngxunya, ifilimu exobukayo, i-carbon inki, i-countersunk hole, imiphetho yepleyiti ene-electroplated, imingxunya yoxinzelelo, umngxuma ubunzulu bokulawula, iV kwi-PAD IA, engaqhubekiyo. umngxuma weplagi ye-resin, umngxuma weplagi owenziwe nge-electroplated, i-Coil PCB, i-PCB encinci ye-ultra-miniature, imaski e peelable, i-PCB ye-impedance elawulekayo, njl. |
