I-Samsung, iMicron ezimbini zokwandiswa kwefektri yokugcina!

Kutshanje, iindaba zomzi mveliso zibonisa ukuba ukuze ujongane nokunyuka kwemfuno yeememori zetshiphu eziqhutywa bubukrelekrele bokwenziwa (AI) boom, i-Samsung Electronics kunye neMicron ziye zandisa umthamo wazo wokuvelisa i-memory chip. I-Samsung iya kuphinda iqalise ukwakhiwa kwezakhiwo zesityalo sayo esitsha sePyeongtaek (P5) kwangoko kwikota yesithathu ka-2024. IMicron yakha uvavanyo lwe-HBM kunye nemigca yokuvelisa umthamo kwikomkhulu layo e-Boise, e-Idaho, kwaye icinga ukuvelisa i-HBM eMalaysia okokuqala. ixesha lokuhlangabezana nemfuno engaphezulu evela kwi-AI boom.

Isamsung iphinde yavula isityalo esitsha sePyeongtaek (P5)
Iindaba zeendaba zangaphandle zibonisa ukuba i-Samsung Electronics yagqiba ekubeni iqalise kwakhona isiseko sesityalo esitsha sePyeongtaek (P5), ekulindeleke ukuba iqalise ukwakhiwa kwakhona kwikota yesithathu ka-2024 kwasekuqaleni, kwaye ixesha lokugqiba kuqikelelwa ukuba ngu-Epreli 2027, kodwa elona xesha lokuvelisa lisenokuba ngaphambili.

Ngokweengxelo zangaphambili, isityalo sayeka ukusebenza ekupheleni kukaJanuwari, kwaye i-Samsung yathi ngelo xesha "eli linyathelo lexeshana lokulungelelanisa inkqubela phambili" kwaye "utyalo-mali alukenziwa." I-Samsung P5 ityala esi sigqibo sokuphinda uqalise ukwakhiwa, ishishini litolike ngakumbi ukuba ukuphendula kubukrelekrele bokwenziwa (AI) boom obuqhutywa yimfuno ye-memory chip, inkampani yandisa ngakumbi umthamo wemveliso.

Kuxelwe ukuba isityalo se-Samsung P5 yilaphu elikhulu elinamagumbi asibhozo acocekileyo, ngelixa i-P1 ukuya kwi-P4 inamagumbi amane acocekileyo kuphela. Oku kwenza ukuba i-Samsung ibe nomthamo wemveliso eninzi ukuhlangabezana neemfuno zemarike. Kodwa okwangoku, akukho lwazi lusemthethweni malunga nenjongo ethile ye-P5.

Ngokweengxelo zeendaba zaseKorea, imithombo yoshishino yathi i-Samsung Electronics ibambe intlanganiso yekomiti yolawulo lwangaphakathi yebhodi yabalawuli ngoMeyi 30 ukungenisa kunye nokwamkela i-ajenda enxulumene neziseko ze-P5. IBhodi yoLawulo ilawulwa yi-CEO kunye neNtloko yeCandelo le-DX uJong-hee Han kwaye iquka uNoh Tae-moon, iNtloko yeCandelo loShishino lweMX, uPark Hak-gyu, uMlawuli weNkxaso yoLawulo, kunye no-Lee Jeong-bae, intloko yoShishino lokuGcina. iyunithi.

U-Hwang Sang-joong, usekela-mongameli kunye nentloko yeemveliso ze-DRAM kunye nobuchwepheshe kwi-Samsung, uthe ngo-Matshi ulindele ukuba imveliso ye-HBM kulo nyaka ibe ngamaxesha angama-2.9 aphezulu kunonyaka odlulileyo. Kwangaxeshanye, inkampani yabhengeza imephu yendlela ye-HBM, elindele ukuba ukuthunyelwa kwe-HBM ngo-2026 kube ngamaxesha angama-13.8 kwimveliso ye-2023, kwaye ngo-2028, imveliso ye-HBM yonyaka iya kunyuka ukuya kumaxesha angama-23.1 kwinqanaba lika-2023.

.I-Micron yakha imigca yemveliso yovavanyo lwe-HBM kunye nemigca yokuvelisa ngobuninzi e-United States
NgoJuni 19, inani leendaba zosasazo libonise ukuba iMicron yakha umgca wemveliso yovavanyo lwe-HBM kunye nomgca wokuvelisa ubuninzi kwikomkhulu layo eBoise, e-Idaho, kwaye iqwalasela imveliso ye-HBM eMalaysia okokuqala ukuhlangabezana nemfuno engaphezulu eziswa bubulumko bokwenziwa. qhuma. Kuxelwe ukuba i-Micron's Boise fab iya kuba kwi-intanethi ngo-2025 kwaye iqalise imveliso ye-DRAM ngo-2026.

IMicron ngaphambili ibhengeze izicwangciso zokunyusa imemori ye-bandwidth ephezulu (i-HBM) isabelo semakethi ukusuka "kwinani eliphakathi kwelinye" ukuya malunga ne-20% ngexesha lonyaka. Ukuza kuthi ga ngoku, iMicron yandise umthamo wokugcina kwiindawo ezininzi.

Ekupheleni kuka-Epreli, i-Micron Technology yabhengeza ngokusemthethweni kwiwebhusayithi yayo esemthethweni ukuba ifumene i-6.1 yeebhiliyoni zeerandi kwinkxaso karhulumente evela kuMthetho weChip kunye neSayensi. Ezi nkxaso-mali, kunye nenkuthazo eyongezelelweyo karhulumente neyendawo, ziya kuxhasa ulwakhiwo lweMicron lwendawo yokwenziwa kwememori ye-DRAM ekhokelayo e-Idaho kunye neendawo ezimbini eziphambili zokwenziwa kwememori ye-DRAM kwiDolophu yaseClay, eNew York.

Iplanti e-Idaho yaqala ukwakhiwa ngo-Okthobha 2023. UMicron uthe isityalo kulindeleke ukuba sibe se-intanethi kwaye sisebenze ngo-2025, kwaye siqalise ngokusemthethweni imveliso ye-DRAM ngo-2026, kwaye imveliso ye-DRAM iya kuqhubeka ikhula ngokukhula kwemfuno yoshishino. Iprojekthi yaseNew York iphantsi koyilo lokuqala, izifundo zentsimi, kunye nezicelo zemvume, kubandakanywa ne-NEPA. Ukwakhiwa kwelaphu kulindeleke ukuba kuqale ngo-2025, kunye nemveliso ezayo kwaye inegalelo kwimveliso ngo-2028 kwaye inyuka ngokuhambelana nemfuno yentengiso kule minyaka ilishumi izayo. Inkxaso karhulumente yase-US iya kuxhasa isicwangciso sikaMicron sokutyala imali emalunga neebhiliyoni ezingama-50 zeerandi kwinkcitho eyinkunzi ekhokelayo ekuveliseni inkumbulo yasekhaya e-United States ngo-2030, ushicilelo lwathi.

NgoMeyi kulo nyaka, iindaba zemihla ngemihla zathi iMicron iza kuchitha i-600 ukuya kwi-800 yeebhiliyoni zeebhiliyoni ukwakha umzi-mveliso we-chip we-DRAM usebenzisa inkqubo ye-microshadow ekhanyayo ye-ultraviolet (EUV) e-Hiroshima, eJapan, ekulindeleke ukuba iqale ekuqaleni kuka-2026 kwaye igqitywe. ekupheleni kuka-2027. Ngaphambili, iJapan ivume i-yen eyi-192 yeebhiliyoni kwinkxaso-mali yokuxhasa iMicron yokwakha isityalo eHiroshima kunye. ukuvelisa isizukulwana esitsha chips.

Iplanti entsha kaMicron eHiroshima, ekufuphi neFab 15 ekhoyo, iya kugxila kwimveliso ye-DRAM, ingabandakanyi ukupakishwa komva kunye novavanyo, kwaye iya kugxila kwiimveliso ze-HBM.

Ngo-Okthobha ngo-2023, iMicron yavula isityalo sayo sesibini esikrelekrele (indibano yokusika kunye novavanyo) ePenang, eMalaysia, notyalo-mali lokuqala lwe-1 yeebhiliyoni zeedola. Emva kokugqitywa komzi-mveliso wokuqala, iMicron yongeza enye ibhiliyoni yeedola ukuze kwandiswe umzi-mveliso wesibini okrelekrele ukuya kutsho kwi-1.5 yesigidi seemitha.